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0.05mm Diameter Silver-Plated Copper Wire With Anti-Oxidation & Corrosion-Proof For Precision Electronics
| Tempat asal | Cina |
|---|---|
| Nama merek | HUONA |
| Sertifikasi | ISO9001, RoHS |
| Nomor model | Kawat tembaga berlapis perak |
| Kuantitas min Order | 10KG |
| Harga | Need to negotiate |
| Kemasan rincian | Karton / Kayu |
| Waktu pengiriman | 10-25 hari kerja |
| Syarat-syarat pembayaran | L/C,T/T,Western Union |
| Menyediakan kemampuan | 100 ton/bulan |
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xDetail produk
| Nama Produk | Kawat tembaga berlapis perak | Bahan pelapis | Perak murni |
|---|---|---|---|
| Diameter | 0,05 mm (± 0,003 mm) | Ketebalan Pelapisan | 0,5–3,0μm |
| Pemanjangan | ≥15% | Daya konduksi | ≥105% IACS (20°C) |
| Suhu Operasional | -60°C hingga +200°C | MOQ | 10KG |
| Menyoroti | Silver-Plated Copper Wire,0.05mm,High-Conductivity |
||
Deskripsi Produk
Product Description
0.05mm High-Conductivity Silver-Plated Copper Wire
High-performance fine conductor for precision electronic components, featuring a high-purity oxygen-free copper core with uniform silver plating for superior electrical performance.
Product Overview
Silver-plated copper wire (0.05mm diameter) from Huona New Material is a high-performance fine conductor composed of a high-purity oxygen-free copper (OFC) core and a uniform, dense silver plating layer. Manufactured through precision drawing and continuous electroplating processes, this 0.10mm wire delivers excellent electrical conductivity, superior oxidation resistance, and reliable solderability. With a diameter tolerance of ±0.003mm and plating thickness of 0.5-3.0μm, it is widely used in high-frequency signal transmission, miniaturized electronic components, and aerospace wiring applications.
Standard Designations & Core Material Foundation
- Base Material: High-purity oxygen-free copper (OFC, ≥99.99%)
- Plating Material: 99.9% pure silver
- Key Specification: 0.05mm diameter (tolerance ±0.003mm)
- Plating Thickness: 0.5-3.0μm (customizable)
- Compliant Standards: ASTM B500, GB/T 4910, IEC 60884
- Manufacturer: Huona New Material, certified to ISO 9001 and IATF 16949
Key Core Advantages
High Conductivity & Signal Integrity
- Enhanced Conductivity: Silver's conductivity (63×10⁶ S/m) is higher than copper, reducing signal loss in high-frequency applications. The 0.10mm diameter balances conductivity and flexibility, making it ideal for high-speed data lines.
- Low Contact Resistance: The silver plating ensures stable, low-resistance connections in connectors and switches, even after repeated mating cycles.
Excellent Oxidation & Corrosion Resistance
- Silver Protective Layer: The dense silver coating prevents copper oxidation at high temperatures or in humid environments, maintaining long-term conductivity stability.
- Corrosion Resistance: Resists sulfurization and most chemical corrosion, suitable for harsh environments such as aerospace and industrial control systems.
Good Mechanical Properties & Processability
- Ductility & Flexibility: Elongation ≥15% (annealed) allows bending and winding on small mandrels (≥0.2mm) without breaking, suitable for fine-pitch components.
- Uniform Plating: Advanced electroplating technology ensures a smooth, consistent silver layer with no peeling or blistering, even after drawing and annealing.
Technical Specifications
| Attribute | Value (Typical) |
|---|---|
| Base Material | Oxygen-Free Copper (OFC) |
| Plating Material | Pure Silver |
| Diameter | 0.05mm (±0.003mm) |
| Plating Thickness | 0.5-3.0μm |
| Tensile Strength | 380-500 MPa (Hard Drawn); 220-300 MPa (Annealed) |
| Elongation | ≥15% |
| Conductivity | ≥105% IACS (20°C) |
| Operating Temperature | -60°C to +200°C |
| Surface Finish | Bright silver, smooth, oxide-free |
Product Specifications
| Item | Specification |
|---|---|
| Supply Form | Spools (100m/500m/1000m per spool) |
| Plating Type | Soft silver plating (for soldering) or hard silver plating (for wear resistance) |
| Packaging | Vacuum-sealed bags + anti-static packaging + outer carton |
| Customization | Diameter (0.02-0.5mm); plating thickness; pre-tinning |
Typical Application Scenarios
- Miniaturized Electronics: Fine-pitch connectors, flexible circuits, and bonding wires for smartphones, wearables, and medical devices.
- High-Frequency Communication: RF cables, antenna elements, and microwave components requiring low loss and high conductivity.
- Aerospace & Defense: Lightweight wiring harnesses, sensor leads, and high-frequency signal lines in aircraft and satellite systems.
- Automotive Electronics: Sensor wires and high-speed data lines in ADAS and infotainment systems.
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